SiP/PCB Design Engineer At USA-California, Folsom

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Job description

In this position, you will be an integral part of NSG’s organization developing world class SSD for the Client and Enterprise. You will work directly with Design, Thermal and Mechanical Engineers and others to design/layout innovative BGA and PCB solutions. These include unique substrate designs in addition to PCB. The work entails design/routing studies prior to achieving the final design. The position also requires design of Validation hardware supporting SSD debug/bring up activity. Additional tasks include defining/maintaining component libraries, schematic entry, feasibility analysis, layout (placement/routing), design verification, documentation and interfacing with subcons as needed. The candidate is expected to use a degree of judgment and initiative in resolving complex non-standard problems and making recommendations. Candidate acts independently or as part of a team to determine methods and follow procedures on standard assignments.

Desired Skills and Experience

You must possess a Bachelor’s degree in Electrical Engineering or Computer Engineering

Two to five years of experience designing system and validation printed circuit boards (PCBs) as well as Package substrate layouts. Layout experience to include high density multilayer packages (BGA/System in Package (SiP)) and PCB typically 2 to 12 layers with combination of surface mount and through hole components
Cadence tools knowledge and experience required. ((OrCAD/CIS, Allegro, APD, SIP) is a must. Must be able to understand and implement design constraints and rules (Physical, DFM, Electrical, Signal Integrity, DFX, etc..).

Full SPEED (Documentation Management Tool) ownership to manage BGA/HW designs using this tool

Excellent communication skills in order to interface with other groups and key stakeholders such as system architects, marketing, design, materials management, manufacturing, external vendors and customers.

Experience with High Density Interconnect (HDI), microvias, blind/buried vias as it applies to both Package and PCB a plus but not required. Flex-rigid experience is also a nice to have. Ability to develop stack-ups to meet signal impedance requirements a plus but not required.
Ability to write tools and scripts (Skill -Cadence, others) to automate design tasks is a plus. Familiarity with lab equipment including, but not limited to, DMM, oscilloscopes, power supplies, other is also a plus.
AutoCAD/Solidworks is also a plus.

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